Method for Keyhole-Free High-Aspect-Ratio Trench Refill by LPCVD
In micro-machined micro-electromechanical systems (MEMS), refilled high-aspect-ratio trench structures are used for different applications. However, these trenches often show keyholes, which have an impact on the performance of the devices. In this paper, explanations are given on keyhole formation,...
| Main Authors: | , , , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2022-11-01
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| Series: | Micromachines |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2072-666X/13/11/1908 |