Damage Metrics for Void Detection in Adhesive Single-Lap Joints

Structural Health Monitoring (SHM) techniques, such as Electromechanical Impedance Spectroscopy (EMIS), aim to continuously monitor structures for defects, thus avoiding the need for regular maintenance. While attention has been given to the application of EMIS in the automatic detection of damage i...

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Bibliographic Details
Main Authors: António Francisco G. Tenreiro, António M. Lopes, Lucas F. M. da Silva
Format: Article
Language:English
Published: MDPI AG 2023-09-01
Series:Mathematics
Subjects:
Online Access:https://www.mdpi.com/2227-7390/11/19/4127