Damage Metrics for Void Detection in Adhesive Single-Lap Joints
Structural Health Monitoring (SHM) techniques, such as Electromechanical Impedance Spectroscopy (EMIS), aim to continuously monitor structures for defects, thus avoiding the need for regular maintenance. While attention has been given to the application of EMIS in the automatic detection of damage i...
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MDPI AG
2023-09-01
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author | António Francisco G. Tenreiro António M. Lopes Lucas F. M. da Silva |
author_facet | António Francisco G. Tenreiro António M. Lopes Lucas F. M. da Silva |
author_sort | António Francisco G. Tenreiro |
collection | DOAJ |
description | Structural Health Monitoring (SHM) techniques, such as Electromechanical Impedance Spectroscopy (EMIS), aim to continuously monitor structures for defects, thus avoiding the need for regular maintenance. While attention has been given to the application of EMIS in the automatic detection of damage in metallic and composite components, integrity monitoring of structural adhesive joints has been comparatively neglected. This paper investigated the use of damage metrics with electrical impedance measurements to detect defects in Single-Lap Joints (SLJs) bonded with a modified epoxy adhesive. Traditional metrics using statistical and distance-based concepts, such as the Root-Mean-Squared Deviation, <inline-formula><math xmlns="http://www.w3.org/1998/Math/MathML" display="inline"><semantics><mrow><mi>R</mi><mi>M</mi><mi>S</mi><mi>D</mi></mrow></semantics></math></inline-formula>, or the Correlation Coefficient, <inline-formula><math xmlns="http://www.w3.org/1998/Math/MathML" display="inline"><semantics><mrow><mi>C</mi><mi>C</mi></mrow></semantics></math></inline-formula>, are addressed at detecting voids in the adhesive layer and are applied to five different spectral frequency ranges. Furthermore, new damage metrics have been developed, such as the Average Canberra Distance, <inline-formula><math xmlns="http://www.w3.org/1998/Math/MathML" display="inline"><semantics><mrow><mi>A</mi><mi>C</mi><mi>D</mi></mrow></semantics></math></inline-formula>, which enables a reduction of possible outliers in damage detection, or the complex Root-Mean-Squared Deviation, <inline-formula><math xmlns="http://www.w3.org/1998/Math/MathML" display="inline"><semantics><mrow><mi>c</mi><mi>R</mi><mi>M</mi><mi>S</mi><mi>D</mi></mrow></semantics></math></inline-formula>, which allows for the use of both the real and imaginary components of the impedance, enabling better damage detection in structural adhesive joints. Overall, damage detection is achieved, and for certain spectral conditions, differentiation between certain damage sizes, using specific metrics, such as the <inline-formula><math xmlns="http://www.w3.org/1998/Math/MathML" display="inline"><semantics><mrow><mi>R</mi><mi>M</mi><mi>S</mi><mi>D</mi></mrow></semantics></math></inline-formula> or <inline-formula><math xmlns="http://www.w3.org/1998/Math/MathML" display="inline"><semantics><mrow><mi>c</mi><mi>R</mi><mi>M</mi><mi>S</mi><mi>D</mi></mrow></semantics></math></inline-formula>, may be possible. Overall, the <inline-formula><math xmlns="http://www.w3.org/1998/Math/MathML" display="inline"><semantics><mrow><mi>R</mi><mi>M</mi><mi>S</mi><mi>D</mi></mrow></semantics></math></inline-formula> or <inline-formula><math xmlns="http://www.w3.org/1998/Math/MathML" display="inline"><semantics><mrow><mi>c</mi><mi>R</mi><mi>M</mi><mi>S</mi><mi>D</mi></mrow></semantics></math></inline-formula> values from damaged SLJs tend to be double the metric values from undamaged joints. |
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spelling | doaj.art-06e8af3f6d374c7f9ab56b439ad7a9ec2023-11-19T14:43:42ZengMDPI AGMathematics2227-73902023-09-011119412710.3390/math11194127Damage Metrics for Void Detection in Adhesive Single-Lap JointsAntónio Francisco G. Tenreiro0António M. Lopes1Lucas F. M. da Silva2Instituto de Ciência e Inovação em Engenharia Mecânica e Engenharia Industrial (INEGI), Campus da FEUP, R. Dr. Roberto Frias 400, 4200-465 Porto, PortugalInstituto de Ciência e Inovação em Engenharia Mecânica e Engenharia Industrial (INEGI), Campus da FEUP, R. Dr. Roberto Frias 400, 4200-465 Porto, PortugalInstituto de Ciência e Inovação em Engenharia Mecânica e Engenharia Industrial (INEGI), Campus da FEUP, R. Dr. Roberto Frias 400, 4200-465 Porto, PortugalStructural Health Monitoring (SHM) techniques, such as Electromechanical Impedance Spectroscopy (EMIS), aim to continuously monitor structures for defects, thus avoiding the need for regular maintenance. While attention has been given to the application of EMIS in the automatic detection of damage in metallic and composite components, integrity monitoring of structural adhesive joints has been comparatively neglected. This paper investigated the use of damage metrics with electrical impedance measurements to detect defects in Single-Lap Joints (SLJs) bonded with a modified epoxy adhesive. Traditional metrics using statistical and distance-based concepts, such as the Root-Mean-Squared Deviation, <inline-formula><math xmlns="http://www.w3.org/1998/Math/MathML" display="inline"><semantics><mrow><mi>R</mi><mi>M</mi><mi>S</mi><mi>D</mi></mrow></semantics></math></inline-formula>, or the Correlation Coefficient, <inline-formula><math xmlns="http://www.w3.org/1998/Math/MathML" display="inline"><semantics><mrow><mi>C</mi><mi>C</mi></mrow></semantics></math></inline-formula>, are addressed at detecting voids in the adhesive layer and are applied to five different spectral frequency ranges. Furthermore, new damage metrics have been developed, such as the Average Canberra Distance, <inline-formula><math xmlns="http://www.w3.org/1998/Math/MathML" display="inline"><semantics><mrow><mi>A</mi><mi>C</mi><mi>D</mi></mrow></semantics></math></inline-formula>, which enables a reduction of possible outliers in damage detection, or the complex Root-Mean-Squared Deviation, <inline-formula><math xmlns="http://www.w3.org/1998/Math/MathML" display="inline"><semantics><mrow><mi>c</mi><mi>R</mi><mi>M</mi><mi>S</mi><mi>D</mi></mrow></semantics></math></inline-formula>, which allows for the use of both the real and imaginary components of the impedance, enabling better damage detection in structural adhesive joints. Overall, damage detection is achieved, and for certain spectral conditions, differentiation between certain damage sizes, using specific metrics, such as the <inline-formula><math xmlns="http://www.w3.org/1998/Math/MathML" display="inline"><semantics><mrow><mi>R</mi><mi>M</mi><mi>S</mi><mi>D</mi></mrow></semantics></math></inline-formula> or <inline-formula><math xmlns="http://www.w3.org/1998/Math/MathML" display="inline"><semantics><mrow><mi>c</mi><mi>R</mi><mi>M</mi><mi>S</mi><mi>D</mi></mrow></semantics></math></inline-formula>, may be possible. Overall, the <inline-formula><math xmlns="http://www.w3.org/1998/Math/MathML" display="inline"><semantics><mrow><mi>R</mi><mi>M</mi><mi>S</mi><mi>D</mi></mrow></semantics></math></inline-formula> or <inline-formula><math xmlns="http://www.w3.org/1998/Math/MathML" display="inline"><semantics><mrow><mi>c</mi><mi>R</mi><mi>M</mi><mi>S</mi><mi>D</mi></mrow></semantics></math></inline-formula> values from damaged SLJs tend to be double the metric values from undamaged joints.https://www.mdpi.com/2227-7390/11/19/4127structural health monitoringelectromechanical impedance spectroscopyadhesive jointsdamage metricspiezoelectric sensorsvoid |
spellingShingle | António Francisco G. Tenreiro António M. Lopes Lucas F. M. da Silva Damage Metrics for Void Detection in Adhesive Single-Lap Joints Mathematics structural health monitoring electromechanical impedance spectroscopy adhesive joints damage metrics piezoelectric sensors void |
title | Damage Metrics for Void Detection in Adhesive Single-Lap Joints |
title_full | Damage Metrics for Void Detection in Adhesive Single-Lap Joints |
title_fullStr | Damage Metrics for Void Detection in Adhesive Single-Lap Joints |
title_full_unstemmed | Damage Metrics for Void Detection in Adhesive Single-Lap Joints |
title_short | Damage Metrics for Void Detection in Adhesive Single-Lap Joints |
title_sort | damage metrics for void detection in adhesive single lap joints |
topic | structural health monitoring electromechanical impedance spectroscopy adhesive joints damage metrics piezoelectric sensors void |
url | https://www.mdpi.com/2227-7390/11/19/4127 |
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