Experiment on single diamond abrasive scratching 2D SiCf/SiC composite materials

Experiment on single diamond abrasive scratching 2D SiCf/SiC composite materials

To reveal the grinding removal mechanism of 2D SiCf/SiC composites, according to the weaving structure characteristics of 2D SiCf/SiC composites, scratching experiments were conducted on the woven surface (WS) and stacking surface (SS) of 2D SiCf/SiC along 0°, 45°, and 90° directions. The experiment...

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Bibliographic Details
Main Authors: Youzhe WANG, Yao LIU, Yang ZHOU, Jiahao LI, Hansen LI
Format: Article
Language:zho
Published: Zhengzhou Research Institute for Abrasives & Grinding Co., Ltd. 2024-06-01
Series:Jin'gangshi yu moliao moju gongcheng
Subjects:
single diamond abrasive scratch
sicf/sic composite material
fiber orientations
scratching force
surface morphology
Online Access:http://www.jgszz.cn/article/doi/10.13394/j.cnki.jgszz.2023.0275

Internet

http://www.jgszz.cn/article/doi/10.13394/j.cnki.jgszz.2023.0275

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