Thermal fatigue life evaluation of substrate with Cu through-hole considering the mechanical properties of Cu thin film and glass fiber cloths structure
In this study, the thermal fatigue life of substrate with Cu through-hole is evaluated by considering the mechanical properties of Cu thin film and glass fiber cloths structure. We first conducted tensile tests of Cu thin film and found that the rate-dependence of inelastic property varies abruptly...
| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | Japanese |
| Published: |
The Japan Society of Mechanical Engineers
2014-12-01
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| Series: | Nihon Kikai Gakkai ronbunshu |
| Subjects: | |
| Online Access: | https://www.jstage.jst.go.jp/article/transjsme/81/821/81_14-00382/_pdf/-char/en |