Robust Inspection of Integrated Circuit Substrates Based on Twin Network With Image Transform and Suppression Modules
Because existing IC substrate inspection methods do not utilize information in the design file, those are prone to failing detection of critical defects such as missing patterns. To remedy the problem, we propose a novel twin network-based inspection system for integrated circuit (IC) substrates tha...
| Main Authors: | , |
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| Format: | Article |
| Language: | English |
| Published: |
IEEE
2023-01-01
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| Series: | IEEE Access |
| Subjects: | |
| Online Access: | https://ieeexplore.ieee.org/document/10168097/ |