Construction of all-organic low dielectric polyimide hybrids via synergistic effect between covalent organic framework and cross-linking structure

Construction of all-organic low dielectric polyimide hybrids via synergistic effect between covalent organic framework and cross-linking structure

Polyimide (PI) is a promising electronic packaging material, but it remains challenging to obtain an all-organic PI hybrid film with decreased dielectric constant and loss without modifying the monomer. Herein, a series of all-organic PI hybrid films were successfully prepared by introducing the cov...

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Bibliographic Details
Main Authors: Wanjing Zhao, Zhaoyang Wei, Chonghao Lu, Yizhang Tong, Jingshu Huang, Xianwu Cao, Dean Shi, Robert K.Y. Li, Wei Wu
Format: Article
Language:English
Published: KeAi Communications Co., Ltd. 2023-12-01
Series:Nano Materials Science
Subjects:
Polyimide
Covalent organic framework
All-organic
Cross-linking structure
Dielectric property
Hybrid film
Online Access:http://www.sciencedirect.com/science/article/pii/S2589965123000053

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http://www.sciencedirect.com/science/article/pii/S2589965123000053

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