Characterization of an Active Soldering Zn-Mg Alloy and the Study of Ultrasonic Soldering of SiC Ceramics with Copper Substrate

Characterization of an Active Soldering Zn-Mg Alloy and the Study of Ultrasonic Soldering of SiC Ceramics with Copper Substrate

The aim of this study was to characterize a Zn-Mg type soldering alloy and direct soldering of SiC ceramics with a copper substrate. The Zn1.5Mg solder exerts a wider melting interval. The temperature of the eutectic reaction was 365 °C, and the liquidus temperature was 405 °C. The microstructure of...

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Bibliographic Details
Main Authors: Roman Kolenak, Alexej Pluhar, Jaromir Drapala, Peter Gogola, Matej Pasak, Mikulas Sloboda
Format: Article
Language:English
Published: MDPI AG 2024-02-01
Series:Applied Sciences
Subjects:
soldering
SiC ceramics
Cu
Zn-Mg solder
ultrasonic soldering
Online Access:https://www.mdpi.com/2076-3417/14/4/1504

Internet

https://www.mdpi.com/2076-3417/14/4/1504

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