Temperature modeling and emulation of an ASIC temperature monitor system for Tightly-Coupled Processor Arrays (TCPAs)

This contribution provides an approach for emulating the behaviour of an ASIC temperature monitoring system (TMon) during run-time for a tightly-coupled processor array (TCPA) of a heterogeneous invasive multi-tile architecture to be used for FPGA prototyping. It is based on a thermal RC modeling ap...

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Bibliographic Details
Main Authors: E. Glocker, S. Boppu, Q. Chen, U. Schlichtmann, J. Teich, D. Schmitt-Landsiedel
Format: Article
Language:deu
Published: Copernicus Publications 2014-11-01
Series:Advances in Radio Science
Online Access:http://www.adv-radio-sci.net/12/103/2014/ars-12-103-2014.pdf