APA (7th ed.) Citation

Glocker, E., Boppu, S., Chen, Q., Schlichtmann, U., Teich, J., & Schmitt-Landsiedel, D. (2014). Temperature modeling and emulation of an ASIC temperature monitor system for Tightly-Coupled Processor Arrays (TCPAs). Copernicus Publications.

Chicago Style (17th ed.) Citation

Glocker, E., S. Boppu, Q. Chen, U. Schlichtmann, J. Teich, and D. Schmitt-Landsiedel. Temperature Modeling and Emulation of an ASIC Temperature Monitor System for Tightly-Coupled Processor Arrays (TCPAs). Copernicus Publications, 2014.

MLA (9th ed.) Citation

Glocker, E., et al. Temperature Modeling and Emulation of an ASIC Temperature Monitor System for Tightly-Coupled Processor Arrays (TCPAs). Copernicus Publications, 2014.