Temperature modeling and emulation of an ASIC temperature monitor system for Tightly-Coupled Processor Arrays (TCPAs)
This contribution provides an approach for emulating the behaviour of an ASIC temperature monitoring system (TMon) during run-time for a tightly-coupled processor array (TCPA) of a heterogeneous invasive multi-tile architecture to be used for FPGA prototyping. It is based on a thermal RC modeling ap...
Main Authors: | E. Glocker, S. Boppu, Q. Chen, U. Schlichtmann, J. Teich, D. Schmitt-Landsiedel |
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Format: | Article |
Language: | deu |
Published: |
Copernicus Publications
2014-11-01
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Series: | Advances in Radio Science |
Online Access: | http://www.adv-radio-sci.net/12/103/2014/ars-12-103-2014.pdf |
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