Internal defect identification method of TSV 3D packaging based on built-in integrated sensor
TSV (Through Silicon Via) is a key technology for three-dimensional (3D) packaging due to its unique vertical interconnection method. However, its particular manufacturing process of-ten leads to internal defects, such as gaps, bottom voids, filling missing, which are usually difficult to be detecte...
| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
SAGE Publishing
2022-09-01
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| Series: | Advances in Mechanical Engineering |
| Online Access: | https://doi.org/10.1177/16878132221121480 |