Effect of Ni-MOF Derivatives on the Electrochemical Corrosion Behavior of Sn-0.7Cu Solders

Effect of Ni-MOF Derivatives on the Electrochemical Corrosion Behavior of Sn-0.7Cu Solders

The corrosion resistance of solder joints is a critical factor affecting the service life of electronic products during long-term operation. In this study, the corrosion behavior of Sn-0.7Cu-<i>x</i>Ni@C (<i>x</i> = 0, 0.04, 0.08, and 0.12 wt.%) composite solders was investig...

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Bibliographic Details
Main Authors: Guoge Lu, Bo Lin, Zhan Gao, Yingxin Li, Fuxiang Wei
Format: Article
Language:English
Published: MDPI AG 2022-07-01
Series:Metals
Subjects:
Sn-0.7Cu
Ni@C addition
microstructure
corrosion behavior
Online Access:https://www.mdpi.com/2075-4701/12/7/1172

Internet

https://www.mdpi.com/2075-4701/12/7/1172

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