Finite element modelling of thin intermetallic compound layer fractures
A thin intermetallic compound (IMC) of solder ball joint induces strong stress concentration between the pad and solder where a crack propagated near the IMC layer. The fracture mechanism of the IMC layer is complex due to the effect of IMC thickness, crack length, solder thickness and Young’s Modul...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Universiti Malaysia Pahang Publishing
2017-03-01
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| Series: | Journal of Mechanical Engineering and Sciences |
| Subjects: | |
| Online Access: | https://journal.ump.edu.my/jmes/article/view/8027 |