Lattice Boltzmann Method of Different BGA Orientations on I-Type Dispensing Method.

Lattice Boltzmann Method of Different BGA Orientations on I-Type Dispensing Method.

This paper studies the three dimensional (3D) simulation of fluid flows through the ball grid array (BGA) to replicate the real underfill encapsulation process. The effect of different solder bump arrangements of BGA on the flow front, pressure and velocity of the fluid is investigated. The flow fro...

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Bibliographic Details
Main Authors: Aizat Abas, Z L Gan, M H H Ishak, M Z Abdullah, Soon Fuat Khor
Format: Article
Language:English
Published: Public Library of Science (PLoS) 2016-01-01
Series:PLoS ONE
Online Access:http://europepmc.org/articles/PMC4959703?pdf=render

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http://europepmc.org/articles/PMC4959703?pdf=render

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