Performance Analysis of Bump in Tapered TSV: Impact on Crosstalk and Power Loss
This study addresses the first feasible, and comprehensive approach to demonstrate a compact resistance-inductance-capacitance-conductance (<italic>RLCG</italic>) model for a multi-walled carbon nanotube bundle (MWB) and multilayered graphene nanoribbon (MLGNR) based tapered through sili...
Main Authors: | , , , |
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Format: | Article |
Language: | English |
Published: |
IEEE
2022-01-01
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Series: | IEEE Open Journal of Nanotechnology |
Subjects: | |
Online Access: | https://ieeexplore.ieee.org/document/9947291/ |