Performance Analysis of Bump in Tapered TSV: Impact on Crosstalk and Power Loss

Performance Analysis of Bump in Tapered TSV: Impact on Crosstalk and Power Loss

This study addresses the first feasible, and comprehensive approach to demonstrate a compact resistance-inductance-capacitance-conductance (<italic>RLCG</italic>) model for a multi-walled carbon nanotube bundle (MWB) and multilayered graphene nanoribbon (MLGNR) based tapered through sili...

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Bibliographic Details
Main Authors: Shivangi Chandrakar, Deepika Gupta, Manoj Kumar Majumder, Brajesh Kumar Kaushik
Format: Article
Language:English
Published: IEEE 2022-01-01
Series:IEEE Open Journal of Nanotechnology
Subjects:
Crosstalk-induced delay
multi-walled carbon nanotube bundle (MWB)
insertion and reflection loss (S21
S11)
resistance–inductance–conductance–capacitance (<named-content xmlns:xlink="http://www.w3.org/1999/xlink" xmlns:ali="http://www.niso.org/schemas/ali/1.0/" xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" content-type="math" xlink:type="simple"> <inline-formula> <tex-math notation="LaTeX">$RLGC$</tex-math> </inline-formula> </named-content>) model
through-silicon via (TSV)
Online Access:https://ieeexplore.ieee.org/document/9947291/

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