Effect of the matrix material and electroplating process on the microstructure and properties of isolation switch contacts
In the KI system, Ag plating, hard-Ag plating and graphene-Ag plating were prepared on the surface of the copper and Cu–Cr alloy matrix materials by the electrodeposition method. The purpose of this paper is to define the copper-based material and related plating process suitable for the contacts of...
| Main Authors: | , , , , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
IOP Publishing
2020-01-01
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| Series: | Materials Research Express |
| Subjects: | |
| Online Access: | https://doi.org/10.1088/2053-1591/abc127 |