Electroless-deposition of epitaxial (111)-oriented silver on nanotwinned copper microbumps for metal direct bonding

A large lattice mismatch between Ag and Cu commonly results in incoherently polycrystalline deposited features. It is very challenging to epitaxially deposit an Ag film on Cu. In this study, an epitaxial Ag film was electroless-deposited on nanotwinned Cu (NT-Cu) microbumps. Although the Ag/Cu large...

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Bibliographic Details
Main Authors: Hsiang-Hou Tseng, Man-Chi Lan, Wei-You Hsu, Jia-Juen Ong, Dinh-Phuc Tran, Chih Chen
Format: Article
Language:English
Published: Elsevier 2023-11-01
Series:Journal of Materials Research and Technology
Subjects:
Online Access:http://www.sciencedirect.com/science/article/pii/S2238785423030144