Electroless-deposition of epitaxial (111)-oriented silver on nanotwinned copper microbumps for metal direct bonding
A large lattice mismatch between Ag and Cu commonly results in incoherently polycrystalline deposited features. It is very challenging to epitaxially deposit an Ag film on Cu. In this study, an epitaxial Ag film was electroless-deposited on nanotwinned Cu (NT-Cu) microbumps. Although the Ag/Cu large...
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| Format: | Article |
| Language: | English |
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Elsevier
2023-11-01
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| Series: | Journal of Materials Research and Technology |
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| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785423030144 |
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| author | Hsiang-Hou Tseng Man-Chi Lan Wei-You Hsu Jia-Juen Ong Dinh-Phuc Tran Chih Chen |
| author_facet | Hsiang-Hou Tseng Man-Chi Lan Wei-You Hsu Jia-Juen Ong Dinh-Phuc Tran Chih Chen |
| author_sort | Hsiang-Hou Tseng |
| collection | DOAJ |
| description | A large lattice mismatch between Ag and Cu commonly results in incoherently polycrystalline deposited features. It is very challenging to epitaxially deposit an Ag film on Cu. In this study, an epitaxial Ag film was electroless-deposited on nanotwinned Cu (NT-Cu) microbumps. Although the Ag/Cu large lattice mismatch, the Ag films replicated the NT-Cu structure and epitaxially grew on the NT-Cu microbumps. Fast Fourier transform (FFT) in high resolution transmission microscopy (HRTEM) was employed to confirm the epitaxial growth. Such Ag films also played a vital role in inhibiting oxidation during the bonding processes of the microbumps. Possessing (111)-preferred orientation and high surface diffusivities, the epitaxial Ag films were thus beneficial for the metal direct bonding at a low temperature below 100 °C in air. HRTEM FFT analysis indicated excellent bonding interfaces with (111) Ag on (111) Cu. Interdiffusion of Cu and Ag atoms may occur during the bonding process to form Cu–Ag alloys to strengthen the bonding interface. |
| first_indexed | 2024-03-07T23:21:30Z |
| format | Article |
| id | doaj.art-09af45e55da540f4aa594bb19ad9e96e |
| institution | Directory Open Access Journal |
| issn | 2238-7854 |
| language | English |
| last_indexed | 2024-03-07T23:21:30Z |
| publishDate | 2023-11-01 |
| publisher | Elsevier |
| record_format | Article |
| series | Journal of Materials Research and Technology |
| spelling | doaj.art-09af45e55da540f4aa594bb19ad9e96e2024-02-21T05:28:38ZengElsevierJournal of Materials Research and Technology2238-78542023-11-012779577963Electroless-deposition of epitaxial (111)-oriented silver on nanotwinned copper microbumps for metal direct bondingHsiang-Hou Tseng0Man-Chi Lan1Wei-You Hsu2Jia-Juen Ong3Dinh-Phuc Tran4Chih Chen5Department of Materials Science and Engineering, National Yang Ming Chiao Tung University, Hsinchu, 30010, TaiwanDepartment of Materials Science and Engineering, National Yang Ming Chiao Tung University, Hsinchu, 30010, TaiwanDepartment of Materials Science and Engineering, National Yang Ming Chiao Tung University, Hsinchu, 30010, TaiwanDepartment of Materials Science and Engineering, National Yang Ming Chiao Tung University, Hsinchu, 30010, TaiwanDepartment of Materials Science and Engineering, National Yang Ming Chiao Tung University, Hsinchu, 30010, TaiwanCorresponding author.; Department of Materials Science and Engineering, National Yang Ming Chiao Tung University, Hsinchu, 30010, TaiwanA large lattice mismatch between Ag and Cu commonly results in incoherently polycrystalline deposited features. It is very challenging to epitaxially deposit an Ag film on Cu. In this study, an epitaxial Ag film was electroless-deposited on nanotwinned Cu (NT-Cu) microbumps. Although the Ag/Cu large lattice mismatch, the Ag films replicated the NT-Cu structure and epitaxially grew on the NT-Cu microbumps. Fast Fourier transform (FFT) in high resolution transmission microscopy (HRTEM) was employed to confirm the epitaxial growth. Such Ag films also played a vital role in inhibiting oxidation during the bonding processes of the microbumps. Possessing (111)-preferred orientation and high surface diffusivities, the epitaxial Ag films were thus beneficial for the metal direct bonding at a low temperature below 100 °C in air. HRTEM FFT analysis indicated excellent bonding interfaces with (111) Ag on (111) Cu. Interdiffusion of Cu and Ag atoms may occur during the bonding process to form Cu–Ag alloys to strengthen the bonding interface.http://www.sciencedirect.com/science/article/pii/S2238785423030144Nanotwinned copperEpitaxial silver filmMetal direct bondingElectroless-depositionDiffusion bonding |
| spellingShingle | Hsiang-Hou Tseng Man-Chi Lan Wei-You Hsu Jia-Juen Ong Dinh-Phuc Tran Chih Chen Electroless-deposition of epitaxial (111)-oriented silver on nanotwinned copper microbumps for metal direct bonding Journal of Materials Research and Technology Nanotwinned copper Epitaxial silver film Metal direct bonding Electroless-deposition Diffusion bonding |
| title | Electroless-deposition of epitaxial (111)-oriented silver on nanotwinned copper microbumps for metal direct bonding |
| title_full | Electroless-deposition of epitaxial (111)-oriented silver on nanotwinned copper microbumps for metal direct bonding |
| title_fullStr | Electroless-deposition of epitaxial (111)-oriented silver on nanotwinned copper microbumps for metal direct bonding |
| title_full_unstemmed | Electroless-deposition of epitaxial (111)-oriented silver on nanotwinned copper microbumps for metal direct bonding |
| title_short | Electroless-deposition of epitaxial (111)-oriented silver on nanotwinned copper microbumps for metal direct bonding |
| title_sort | electroless deposition of epitaxial 111 oriented silver on nanotwinned copper microbumps for metal direct bonding |
| topic | Nanotwinned copper Epitaxial silver film Metal direct bonding Electroless-deposition Diffusion bonding |
| url | http://www.sciencedirect.com/science/article/pii/S2238785423030144 |
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