Lifetime modeling of solder joints based on accelerated mechanical testing and Finite Element Analysis
Solder fatigue is among the predominant failure modes observed in power electronic modules. Under service conditions power electronic parts are exposed to repeated temperature swings originating from resistance heating. In consequence of a mismatch of the coefficients of thermal expansion, thermomec...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2023-03-01
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| Series: | Power Electronic Devices and Components |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2772370423000020 |