Diffusion Barrier Properties of the Intermetallic Compound Layers Formed in the Pt Nanoparticles Alloyed Sn-58Bi Solder Joints Reacted with ENIG and ENEPIG Surface Finishes
Pt-nanoparticle (NP)-alloyed Sn-58Bi solders were reacted with electroless nickel-immersion gold (ENIG) and electroless nickel-electroless palladium-immersion gold (ENEPIG) surface finishes. We investigated formation of intermetallic compounds (IMCs) and their diffusion barrier properties at reactio...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2022-11-01
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| Series: | Materials |
| Subjects: | |
| Online Access: | https://www.mdpi.com/1996-1944/15/23/8419 |