Diffusion Barrier Properties of the Intermetallic Compound Layers Formed in the Pt Nanoparticles Alloyed Sn-58Bi Solder Joints Reacted with ENIG and ENEPIG Surface Finishes

Diffusion Barrier Properties of the Intermetallic Compound Layers Formed in the Pt Nanoparticles Alloyed Sn-58Bi Solder Joints Reacted with ENIG and ENEPIG Surface Finishes

Pt-nanoparticle (NP)-alloyed Sn-58Bi solders were reacted with electroless nickel-immersion gold (ENIG) and electroless nickel-electroless palladium-immersion gold (ENEPIG) surface finishes. We investigated formation of intermetallic compounds (IMCs) and their diffusion barrier properties at reactio...

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Bibliographic Details
Main Authors:	Hyeokgi Choi, Chang-Lae Kim, Yoonchul Sohn
Format:	Article
Language:	English
Published:	MDPI AG 2022-11-01
Series:	Materials
Subjects:	intermetallic compound diffusion barrier interfacial reaction Sn-58Bi scanning electron microscopy
Online Access:	https://www.mdpi.com/1996-1944/15/23/8419

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