The Reliability of the Complex Components under Temperature Cycling, Random Vibration, and Combined Loading for Airborne Applications
The electronic devices suffer great vibration and temperature fluctuation in an airborne environment, which has been always a big challenge for reliability design. In this paper, the reliability of the complex electronic components for airborne applications under a thermal cycling test, random vibra...
| Main Authors: | , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2023-03-01
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| Series: | Crystals |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2073-4352/13/3/473 |