The Reliability of the Complex Components under Temperature Cycling, Random Vibration, and Combined Loading for Airborne Applications

The Reliability of the Complex Components under Temperature Cycling, Random Vibration, and Combined Loading for Airborne Applications

The electronic devices suffer great vibration and temperature fluctuation in an airborne environment, which has been always a big challenge for reliability design. In this paper, the reliability of the complex electronic components for airborne applications under a thermal cycling test, random vibra...

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Bibliographic Details
Main Authors: Hao Cui, Wenchao Tian, Hanyang Xu, Heng Wang, Jiabo Huang, Chunxi Peng, Zhiqiang Chen
Format: Article
Language:English
Published: MDPI AG 2023-03-01
Series:Crystals
Subjects:
reliability
thermal cycle
random vibration
combined loading
failure life
Online Access:https://www.mdpi.com/2073-4352/13/3/473

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https://www.mdpi.com/2073-4352/13/3/473

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