The application of 3D design technologies in SiP
SiP(System-in-Package) is the latest microelectronic packaging and system integration technology, now it has become a hot spot in the development of electronic technology. The most distinctive feature of SiP is the use of 3D(Three Dimensions) technology in package. Through 3D technology, we can achi...
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| Format: | Article |
| Language: | zho |
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National Computer System Engineering Research Institute of China
2018-09-01
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| Series: | Dianzi Jishu Yingyong |
| Subjects: | |
| Online Access: | http://www.chinaaet.com/article/3000089912 |