Crystalline Silicon Spalling as a Direct Application of Temperature Effect on Semiconductors’ Indentation
Kerf-less removal of surface layers of photovoltaic materials including silicon is an emerging technology by controlled spalling technology. The method is extremely simple, versatile, and applicable to a wide range of substrates. Controlled spalling technology requires a stressor layer, such as Ni,...
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| Format: | Article |
| Language: | English |
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MDPI AG
2021-08-01
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| Series: | Crystals |
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| Online Access: | https://www.mdpi.com/2073-4352/11/9/1020 |