Enhancement of Mechanical and Bond Properties of Epoxy Adhesives Modified by SiO<sub>2</sub> Nanoparticles with Active Groups
In order to improve the mechanical and bond properties of epoxy adhesives for their wide scope of applications, modified epoxy adhesives were produced in this study with SiO<sub>2</sub> nanoparticles of 20 nm in size, including inactive groups, NH<sub>2</sub> active groups, a...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2022-05-01
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| Series: | Polymers |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2073-4360/14/10/2052 |