RF Overdrive Burnout Behavior and Mechanism Analysis of GaN HEMTs Based on High Speed Camera
In this work, a new method for failure analysis of electronic components, high speed camera, is used to investigate burnout failure location of GaN HEMTs under RF overdrive stress. Based on the high speed camera system and the RF test system, we can filter out most of the burn flashes, and clearly l...
| Main Authors: | , , , , , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
IEEE
2023-01-01
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| Series: | IEEE Journal of the Electron Devices Society |
| Subjects: | |
| Online Access: | https://ieeexplore.ieee.org/document/10024816/ |