Laser-based Thickness Control in a Double-Side Polishing System for Silicon Wafers
Thickness control is a critical process of automated polishing of large and thin Si wafers in the semiconductor industry. In this paper, an elaborate double-side polishing (DSP) system is demonstrated, which has a polishing unit with feedback control of wafer thickness based on the scan data of a la...
| Main Authors: | , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2020-03-01
|
| Series: | Sensors |
| Subjects: | |
| Online Access: | https://www.mdpi.com/1424-8220/20/6/1603 |