DDR4 Data Channel Failure Due to DC Offset Caused by Intermittent Solder Ball Fracture in FBGA Package
This paper shows that an intermittent AC coupling defect occurring in a DDR4 data channel will cause more intermittent errors in DDR4, compared to such defect in DDR3. The intermittent AC coupling defect occurs due to intermittent fracture in DDR4 package solder ball. The defect causes DC offset in...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
IEEE
2021-01-01
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| Series: | IEEE Access |
| Subjects: | |
| Online Access: | https://ieeexplore.ieee.org/document/9409102/ |