Preparation of Graphene‐Based Hydrogel Thermal Interface Materials with Excellent Heat Dissipation and Mechanical Properties

Preparation of Graphene‐Based Hydrogel Thermal Interface Materials with Excellent Heat Dissipation and Mechanical Properties

Abstract Heat dissipation has become an essential factor affecting the performance and operating life of electronic devices as the development of modern electronic devices continues to miniaturize and integrate to increase power density. The development of new thermal interface materials has been th...

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Bibliographic Details
Main Authors: Jingying Ma, Wenqiao Du, Zhimin Chen, Wei Wang, Long Zhang
Format: Article
Language:English
Published: Wiley-VCH 2023-01-01
Series:Macromolecular Materials and Engineering
Subjects:
cross‐linking
graphene
heat dissipation
hydrogels
thermal conductivity
thermal interface materials
Online Access:https://doi.org/10.1002/mame.202200332

Internet

https://doi.org/10.1002/mame.202200332

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