Quantitative Imaging of the Stress/Strain Fields and Generation of Macroscopic Cracks from Indents in Silicon

The crack geometry and associated strain field around Berkovich and Vickers indents on silicon have been studied by X-ray diffraction imaging and micro-Raman spectroscopy scanning. The techniques are complementary; the Raman data come from within a few micrometres of the indentation, whereas the X-r...

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Bibliographic Details
Main Authors: Brian K. Tanner, David Allen, Jochen Wittge, Andreas N. Danilewsky, Jorge Garagorri, Eider Gorostegui-Colinas, M. Reyes Elizalde, Patrick J. McNally
Format: Article
Language:English
Published: MDPI AG 2017-11-01
Series:Crystals
Subjects:
Online Access:https://www.mdpi.com/2073-4352/7/11/347