Development of micron-sized Cu–Ag composite paste for oxidation-free bare Cu bonding in air condition and its deterioration mechanism during aging and power cycling tests
The development of next-generation power electronics requires the semiconductor power devices with higher voltage endurance, higher electrical current density under high-temperature operations above 250 °C. Herein, we propose the uses of combined micron-sized Cu particles with Ag–amino composite to...
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| Format: | Article |
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Elsevier
2023-05-01
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| Series: | Journal of Materials Research and Technology |
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| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785423010694 |
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| author | Chuantong Chen Dongjin Kim Yang Liu Takuya Sekiguchi Yutai Su Xu Long Canyu Liu Changqing Liu Katsuaki Suganuma |
| author_facet | Chuantong Chen Dongjin Kim Yang Liu Takuya Sekiguchi Yutai Su Xu Long Canyu Liu Changqing Liu Katsuaki Suganuma |
| author_sort | Chuantong Chen |
| collection | DOAJ |
| description | The development of next-generation power electronics requires the semiconductor power devices with higher voltage endurance, higher electrical current density under high-temperature operations above 250 °C. Herein, we propose the uses of combined micron-sized Cu particles with Ag–amino composite to achieve a robust direct Cu–Cu bonding under a low sintering pressure and temperature (300 °C) in ambient atmosphere. The strong bonding strength of the Cu–Cu joint structure was evaluated as high as 45.3 MPa under 300 °C sintering temperature with low pressure (1 MPa). For the high temperature reliability evaluation, the sintered Cu–Ag composite Cu–Cu joints were stored at 250 °C in air. The shear strength of the joints remains above 30 MPa after 500 h ageing, suggesting an excellent mechanical stability during high temperature storage. Additionally, a SiC Schottky barrier diode with the sintered Cu–Ag composite joint structure was evaluated during a power cycle test at a junction temperature of 200 °C for 10,000 cycles. The thermal resistance of the joint structure was almost unaffected, and no large delamination was observed after the power cycle test, indicating that the Cu–Ag composite material exhibit remarkable potential in SiC power devices packaging. |
| first_indexed | 2024-03-13T04:07:59Z |
| format | Article |
| id | doaj.art-0c9a2dce0b1a4fb0848aa5610fa78d36 |
| institution | Directory Open Access Journal |
| issn | 2238-7854 |
| language | English |
| last_indexed | 2024-03-13T04:07:59Z |
| publishDate | 2023-05-01 |
| publisher | Elsevier |
| record_format | Article |
| series | Journal of Materials Research and Technology |
| spelling | doaj.art-0c9a2dce0b1a4fb0848aa5610fa78d362023-06-21T06:57:45ZengElsevierJournal of Materials Research and Technology2238-78542023-05-012489678983Development of micron-sized Cu–Ag composite paste for oxidation-free bare Cu bonding in air condition and its deterioration mechanism during aging and power cycling testsChuantong Chen0Dongjin Kim1Yang Liu2Takuya Sekiguchi3Yutai Su4Xu Long5Canyu Liu6Changqing Liu7Katsuaki Suganuma8Institute of Scientific and Industrial Research (SANKEN), Osaka University, 8-1 Mihogaoka, Ibaraki, Osaka, 5670047, Japan; Corresponding author.Advanced Joining and Additive Manufacturing R&D Department, Korea Institute of Industrial Technology, 156 Geatbeol-ro, Incheon, 21999, Republic of KoreaInstitute of Scientific and Industrial Research (SANKEN), Osaka University, 8-1 Mihogaoka, Ibaraki, Osaka, 5670047, JapanCentral Research Center, Toppan Forms Co., Ltd. 1-2-6 Owada-cho, Hachioji-shi, Tokyo, JapanSchool of Mechanics, Civil Engineering and Architecture, Northwestern Polytechnical University, Xi'an, Shaanxi, 710129, ChinaSchool of Mechanics, Civil Engineering and Architecture, Northwestern Polytechnical University, Xi'an, Shaanxi, 710129, ChinaWolfson School of Mechanical, Electrical and Manufacturing Engineering, Loughborough University, Loughborough, LE11 3TU, UKWolfson School of Mechanical, Electrical and Manufacturing Engineering, Loughborough University, Loughborough, LE11 3TU, UKInstitute of Scientific and Industrial Research (SANKEN), Osaka University, 8-1 Mihogaoka, Ibaraki, Osaka, 5670047, JapanThe development of next-generation power electronics requires the semiconductor power devices with higher voltage endurance, higher electrical current density under high-temperature operations above 250 °C. Herein, we propose the uses of combined micron-sized Cu particles with Ag–amino composite to achieve a robust direct Cu–Cu bonding under a low sintering pressure and temperature (300 °C) in ambient atmosphere. The strong bonding strength of the Cu–Cu joint structure was evaluated as high as 45.3 MPa under 300 °C sintering temperature with low pressure (1 MPa). For the high temperature reliability evaluation, the sintered Cu–Ag composite Cu–Cu joints were stored at 250 °C in air. The shear strength of the joints remains above 30 MPa after 500 h ageing, suggesting an excellent mechanical stability during high temperature storage. Additionally, a SiC Schottky barrier diode with the sintered Cu–Ag composite joint structure was evaluated during a power cycle test at a junction temperature of 200 °C for 10,000 cycles. The thermal resistance of the joint structure was almost unaffected, and no large delamination was observed after the power cycle test, indicating that the Cu–Ag composite material exhibit remarkable potential in SiC power devices packaging.http://www.sciencedirect.com/science/article/pii/S2238785423010694Direct Cu bondingSinteringCu–Ag composite PasteAnti-oxidationElectronic packagingHigh temperature reliability |
| spellingShingle | Chuantong Chen Dongjin Kim Yang Liu Takuya Sekiguchi Yutai Su Xu Long Canyu Liu Changqing Liu Katsuaki Suganuma Development of micron-sized Cu–Ag composite paste for oxidation-free bare Cu bonding in air condition and its deterioration mechanism during aging and power cycling tests Journal of Materials Research and Technology Direct Cu bonding Sintering Cu–Ag composite Paste Anti-oxidation Electronic packaging High temperature reliability |
| title | Development of micron-sized Cu–Ag composite paste for oxidation-free bare Cu bonding in air condition and its deterioration mechanism during aging and power cycling tests |
| title_full | Development of micron-sized Cu–Ag composite paste for oxidation-free bare Cu bonding in air condition and its deterioration mechanism during aging and power cycling tests |
| title_fullStr | Development of micron-sized Cu–Ag composite paste for oxidation-free bare Cu bonding in air condition and its deterioration mechanism during aging and power cycling tests |
| title_full_unstemmed | Development of micron-sized Cu–Ag composite paste for oxidation-free bare Cu bonding in air condition and its deterioration mechanism during aging and power cycling tests |
| title_short | Development of micron-sized Cu–Ag composite paste for oxidation-free bare Cu bonding in air condition and its deterioration mechanism during aging and power cycling tests |
| title_sort | development of micron sized cu ag composite paste for oxidation free bare cu bonding in air condition and its deterioration mechanism during aging and power cycling tests |
| topic | Direct Cu bonding Sintering Cu–Ag composite Paste Anti-oxidation Electronic packaging High temperature reliability |
| url | http://www.sciencedirect.com/science/article/pii/S2238785423010694 |
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