Development of micron-sized Cu–Ag composite paste for oxidation-free bare Cu bonding in air condition and its deterioration mechanism during aging and power cycling tests
The development of next-generation power electronics requires the semiconductor power devices with higher voltage endurance, higher electrical current density under high-temperature operations above 250 °C. Herein, we propose the uses of combined micron-sized Cu particles with Ag–amino composite to...
| Main Authors: | , , , , , , , , |
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| Formato: | Artigo |
| Idioma: | English |
| Publicado em: |
Elsevier
2023-05-01
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| Colecção: | Journal of Materials Research and Technology |
| Assuntos: | |
| Acesso em linha: | http://www.sciencedirect.com/science/article/pii/S2238785423010694 |