Electrochemical Thin Film Deposition of Copper(I) Halides in Aqueous Solution: Substrate Extension and Structure Transformation

Electrochemical Thin Film Deposition of Copper(I) Halides in Aqueous Solution: Substrate Extension and Structure Transformation

Abstract In this paper, a green and simple electrochemical method is developed that can directly deposit thin films of [CuX(pyz)]n and [Cu2X2(pyz)]n (X = Cl, Br, I; pyz = pyrazine) in aqueous solution. This method can overcome the thermodynamical instability of Cu(I) and the poor solubility of hybri...

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Bibliographic Details
Main Authors: Si‐Yu Xu, Ya‐Nan Wu, Bi‐Cui Chen, Pei‐Wen Huang, Zhi‐Zhuan Zhang, Yu Zhong, Yi Zhao, Xiao‐Ying Huang, Ke‐Zhao Du
Format: Article
Language:English
Published: Wiley-VCH 2022-04-01
Series:Advanced Materials Interfaces
Subjects:
cuprous halides
electrochemical deposition
flexible devices
photoelectricity
solid‐solid luminescent switching
Online Access:https://doi.org/10.1002/admi.202102239

Internet

https://doi.org/10.1002/admi.202102239

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