Materials Quest for Advanced Interconnect Metallization in Integrated Circuits

Materials Quest for Advanced Interconnect Metallization in Integrated Circuits

Abstract Integrated circuits (ICs) are challenged to deliver historically anticipated performance improvements while increasing the cost and complexity of the technology with each generation. Front‐end‐of‐line (FEOL) processes have provided various solutions to this predicament, whereas the back‐end...

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Bibliographic Details
Main Authors: Jun Hwan Moon, Eunjin Jeong, Seunghyun Kim, Taesoon Kim, Eunsoo Oh, Keun Lee, Hauk Han, Young Keun Kim
Format: Article
Language:English
Published: Wiley 2023-08-01
Series:Advanced Science
Subjects:
electrical resistivity
electromigration
integrated circuit
interconnect
metallization
semiconductor
Online Access:https://doi.org/10.1002/advs.202207321

Internet

https://doi.org/10.1002/advs.202207321

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