Highly dynamic tempered in-mold thermocompression bonding of microfluidic chips: process characteristics and bonding performances

Thermoplastic microfluidic chips show broad development prospects in biomedicine, point-of-care testing, healthcare, environmental monitoring, etc. However, improving the production efficiency of microfluidic chips remains a key industrial challenge to promote rapid popularization. In this work, we...

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Bibliographic Details
Main Authors: Baishun Zhao, Wangqing Wu, Mingyong Zhou, Bingyan Jiang, Gerhard Ziegmann
Format: Article
Language:English
Published: Elsevier 2023-05-01
Series:Journal of Materials Research and Technology
Subjects:
Online Access:http://www.sciencedirect.com/science/article/pii/S2238785423005021