Highly dynamic tempered in-mold thermocompression bonding of microfluidic chips: process characteristics and bonding performances
Thermoplastic microfluidic chips show broad development prospects in biomedicine, point-of-care testing, healthcare, environmental monitoring, etc. However, improving the production efficiency of microfluidic chips remains a key industrial challenge to promote rapid popularization. In this work, we...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
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Elsevier
2023-05-01
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| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785423005021 |
| _version_ | 1797798850365227008 |
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| author | Baishun Zhao Wangqing Wu Mingyong Zhou Bingyan Jiang Gerhard Ziegmann |
| author_facet | Baishun Zhao Wangqing Wu Mingyong Zhou Bingyan Jiang Gerhard Ziegmann |
| author_sort | Baishun Zhao |
| collection | DOAJ |
| description | Thermoplastic microfluidic chips show broad development prospects in biomedicine, point-of-care testing, healthcare, environmental monitoring, etc. However, improving the production efficiency of microfluidic chips remains a key industrial challenge to promote rapid popularization. In this work, we proposed a novel method for rapid and mass production of microfluidic chips based on a highly dynamic tempered in-mold thermocompression bonding (HD-IMTCB) process. The bonding temperature was tuned by a highly dynamic local variotherm technology based on thick film heaters. The results show that bonding temperature was the most significant factor for the bonding strength, and bonding time was the lowest one, which can be primarily optimized. With the bonding temperature reaching Vicat Softening Temperature and Glass Transition Temperature, the micro-channel deformation and bonding strength increased exponentially successively. The stable bonding strength reached 560–640 kPa with a microchannel deformation of less than 15%. The well-bonded thermoplastic microfluidic chips have been manufactured by the HD-IMTCB process from raw materials within 5 min, which not only improves the thermocompression bonding from a low-scale to a high-scale production model but also provides a blueprint for commercialization. |
| first_indexed | 2024-03-13T04:10:05Z |
| format | Article |
| id | doaj.art-10a11c1c4d854b9786f3d0f144092b94 |
| institution | Directory Open Access Journal |
| issn | 2238-7854 |
| language | English |
| last_indexed | 2024-03-13T04:10:05Z |
| publishDate | 2023-05-01 |
| publisher | Elsevier |
| record_format | Article |
| series | Journal of Materials Research and Technology |
| spelling | doaj.art-10a11c1c4d854b9786f3d0f144092b942023-06-21T06:55:37ZengElsevierJournal of Materials Research and Technology2238-78542023-05-0124639652Highly dynamic tempered in-mold thermocompression bonding of microfluidic chips: process characteristics and bonding performancesBaishun Zhao0Wangqing Wu1Mingyong Zhou2Bingyan Jiang3Gerhard Ziegmann4State Key Laboratory of High-Performance Complex Manufacturing, School of Mechanical and Electrical Engineering, Central South University, Changsha 410083, ChinaState Key Laboratory of High-Performance Complex Manufacturing, School of Mechanical and Electrical Engineering, Central South University, Changsha 410083, China; Corresponding author. Central South University, School of Mechanical and Electrical Engineering, Lushan South Road 932, 410083 Changsha, Hunan, China.State Key Laboratory of High-Performance Complex Manufacturing, School of Mechanical and Electrical Engineering, Central South University, Changsha 410083, ChinaState Key Laboratory of High-Performance Complex Manufacturing, School of Mechanical and Electrical Engineering, Central South University, Changsha 410083, ChinaClausthal University of Technology, Institute of Polymer Materials and Plastics Engineering, Agricolastrasse 6, D-38678 Clausthal-Zellerfeld, GermanyThermoplastic microfluidic chips show broad development prospects in biomedicine, point-of-care testing, healthcare, environmental monitoring, etc. However, improving the production efficiency of microfluidic chips remains a key industrial challenge to promote rapid popularization. In this work, we proposed a novel method for rapid and mass production of microfluidic chips based on a highly dynamic tempered in-mold thermocompression bonding (HD-IMTCB) process. The bonding temperature was tuned by a highly dynamic local variotherm technology based on thick film heaters. The results show that bonding temperature was the most significant factor for the bonding strength, and bonding time was the lowest one, which can be primarily optimized. With the bonding temperature reaching Vicat Softening Temperature and Glass Transition Temperature, the micro-channel deformation and bonding strength increased exponentially successively. The stable bonding strength reached 560–640 kPa with a microchannel deformation of less than 15%. The well-bonded thermoplastic microfluidic chips have been manufactured by the HD-IMTCB process from raw materials within 5 min, which not only improves the thermocompression bonding from a low-scale to a high-scale production model but also provides a blueprint for commercialization.http://www.sciencedirect.com/science/article/pii/S2238785423005021Microfluidic chipsIn-mold thermocompression bondingBonding technologyManufacturing of microfluidic chipsMicro-injection molding |
| spellingShingle | Baishun Zhao Wangqing Wu Mingyong Zhou Bingyan Jiang Gerhard Ziegmann Highly dynamic tempered in-mold thermocompression bonding of microfluidic chips: process characteristics and bonding performances Journal of Materials Research and Technology Microfluidic chips In-mold thermocompression bonding Bonding technology Manufacturing of microfluidic chips Micro-injection molding |
| title | Highly dynamic tempered in-mold thermocompression bonding of microfluidic chips: process characteristics and bonding performances |
| title_full | Highly dynamic tempered in-mold thermocompression bonding of microfluidic chips: process characteristics and bonding performances |
| title_fullStr | Highly dynamic tempered in-mold thermocompression bonding of microfluidic chips: process characteristics and bonding performances |
| title_full_unstemmed | Highly dynamic tempered in-mold thermocompression bonding of microfluidic chips: process characteristics and bonding performances |
| title_short | Highly dynamic tempered in-mold thermocompression bonding of microfluidic chips: process characteristics and bonding performances |
| title_sort | highly dynamic tempered in mold thermocompression bonding of microfluidic chips process characteristics and bonding performances |
| topic | Microfluidic chips In-mold thermocompression bonding Bonding technology Manufacturing of microfluidic chips Micro-injection molding |
| url | http://www.sciencedirect.com/science/article/pii/S2238785423005021 |
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