Multi-factor coupled failure mechanism of W–Cu functionally graded material under thermal shock service

Multi-factor coupled failure mechanism of W–Cu functionally graded material under thermal shock service

The stability of W–Cu functionally graded material (FGM) as a heat sink connecting material is of significant importance for long-term service under high-temperature thermal cycling conditions. In this study, W–Cu FGM was successfully fabricated by powder metallurgy method. Various thermal shock exp...

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Bibliographic Details
Main Authors: Pengqi Chen, Dang Xu, Chengyang Huang, Jian Yang, Yunxiao Tai, Tao Hong, Jigui Cheng, Hongyu Chen
Format: Article
Language:English
Published: Elsevier 2023-11-01
Series:Journal of Materials Research and Technology
Subjects:
W-Cu FGM
Thermal shock
Failure mechanism
Microcrack
Online Access:http://www.sciencedirect.com/science/article/pii/S2238785423027667

Internet

http://www.sciencedirect.com/science/article/pii/S2238785423027667

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