Modeling and Thermal Stress Coupling Optimization Design of TSV Inductors in On-Chip DC/DC Converters

As advances in fabrication technology continue and the power density of microelectronic devices increases, efficient and highly integrated through-silicon via (TSV) inductors have emerged as a viable solution for addressing challenges in power and thermal stress management in on-chip direct current-...

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Bibliographic Details
Main Authors: Huangyin Wang, Yikai Xiong, Liming Geng
Format: Article
Language:English
Published: IEEE 2023-01-01
Series:IEEE Access
Subjects:
Online Access:https://ieeexplore.ieee.org/document/10328749/