Modeling and Thermal Stress Coupling Optimization Design of TSV Inductors in On-Chip DC/DC Converters
As advances in fabrication technology continue and the power density of microelectronic devices increases, efficient and highly integrated through-silicon via (TSV) inductors have emerged as a viable solution for addressing challenges in power and thermal stress management in on-chip direct current-...
| Principais autores: | , , |
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| Formato: | Artigo |
| Idioma: | English |
| Publicado em: |
IEEE
2023-01-01
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| coleção: | IEEE Access |
| Assuntos: | |
| Acesso em linha: | https://ieeexplore.ieee.org/document/10328749/ |