Development of rotary table grinding machine for large diameter Si wafers (2nd report: Performance investigation of wheel spindle designed to govern infeed motion)

Development of rotary table grinding machine for large diameter Si wafers (2nd report: Performance investigation of wheel spindle designed to govern infeed motion)

Si wafer diameter tends to be increased from 300 mm to 450 mm in order to increase semiconductor device productivity. To this end, the authors developed a rotary grinding machine with high stiffness, equipped with water hydrostatic bearings. This grinding spindle is designed to govern infeed motion...

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Bibliographic Details
Main Authors: Jumpei KUSUYAMA, Ayumu HONDA, Shintaro IWAHASHI, Takayuki KITAJIMA, Akinori YUI, Toshihiro ITO, Xiaodong LU, Alexander H. SLOCUM
Format: Article
Language:Japanese
Published: The Japan Society of Mechanical Engineers 2017-08-01
Series:Nihon Kikai Gakkai ronbunshu
Subjects:
rotary grinding machine
large-diameter si wafer
magnetic actuator
high stiffness
wheel spindle
Online Access:https://www.jstage.jst.go.jp/article/transjsme/83/852/83_17-00102/_pdf/-char/en

Internet

https://www.jstage.jst.go.jp/article/transjsme/83/852/83_17-00102/_pdf/-char/en

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