Development of rotary table grinding machine for large diameter Si wafers (2nd report: Performance investigation of wheel spindle designed to govern infeed motion)
Si wafer diameter tends to be increased from 300 mm to 450 mm in order to increase semiconductor device productivity. To this end, the authors developed a rotary grinding machine with high stiffness, equipped with water hydrostatic bearings. This grinding spindle is designed to govern infeed motion...
| Main Authors: | , , , , , , , |
|---|---|
| Format: | Article |
| Language: | Japanese |
| Published: |
The Japan Society of Mechanical Engineers
2017-08-01
|
| Series: | Nihon Kikai Gakkai ronbunshu |
| Subjects: | |
| Online Access: | https://www.jstage.jst.go.jp/article/transjsme/83/852/83_17-00102/_pdf/-char/en |