Microstructure, thermal behavior and joint strength of Sn-0.7Cu-1.5Bi/electroless nickel immersion gold (ENIG)

Microstructure, thermal behavior and joint strength of Sn-0.7Cu-1.5Bi/electroless nickel immersion gold (ENIG)

This paper details an investigation into the microstructure, thermal behaviors and joint strength of Sn-0.7Cu-1.5Bi solder alloy on electroless nickel immersion gold (ENIG) surface finish. Besides conventional techniques, the real-time synchrotron imaging was used to analyze the microstructure evolu...

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Bibliographic Details
Main Authors: A.L. Teoh, M.A.A. Mohd Salleh, D.S.C. Halin, K.L. Foo, N.R. Abdul Razak, H. Yasuda, K. Nogita
Format: Article
Language:English
Published: Elsevier 2021-05-01
Series:Journal of Materials Research and Technology
Subjects:
Lead-free solder
Intermetallic compound
Solid solution strengthening
Online Access:http://www.sciencedirect.com/science/article/pii/S2238785421002957

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http://www.sciencedirect.com/science/article/pii/S2238785421002957

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