Emerging Non-Noble-Metal Atomic Layer Deposited Copper as Seeds for Electroless Copper Deposition

Emerging Non-Noble-Metal Atomic Layer Deposited Copper as Seeds for Electroless Copper Deposition

Copper metal catalyst seeds have recently triggered much research interest for the development of low-cost and high-performance metallic catalysts with industrial applications. Herein, we present metallic Cu catalyst seeds deposited by an atomic layer deposition method on polymer substrates. The ato...

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Bibliographic Details
Main Authors: Zihong Gao, Chengli Zhang, Qiang Wang, Guanglong Xu, Guoyou Gan, Hongliang Zhang
Format: Article
Language:English
Published: MDPI AG 2024-04-01
Series:Materials
Subjects:
Cu catalyst seeds
atomic layer deposition copper
electroless plating
copper printed circuits
Online Access:https://www.mdpi.com/1996-1944/17/7/1620

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https://www.mdpi.com/1996-1944/17/7/1620

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