Influence of ECAP Parameters on Electrical Conductivity and Hardness of Pure Cu
In this study, the ECAP process was conducted using two different dies of channel angles (Φ) 120° and 90° to extrude pure Cu for 2 and 6 passes of route Bc at room temperature. Optical Microscopy (OM) was used to study the microstructure of Cu before and after ECAP processing. Vicker’s microhardness...
| Main Authors: | , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Port Said University
2022-12-01
|
| Series: | Port Said Engineering Research Journal |
| Subjects: | |
| Online Access: | https://pserj.journals.ekb.eg/article_256707_020a5665fab4c78730441fadea1f33ab.pdf |