Influence of ECAP Parameters on Electrical Conductivity and Hardness of Pure Cu

Influence of ECAP Parameters on Electrical Conductivity and Hardness of Pure Cu

In this study, the ECAP process was conducted using two different dies of channel angles (Φ) 120° and 90° to extrude pure Cu for 2 and 6 passes of route Bc at room temperature. Optical Microscopy (OM) was used to study the microstructure of Cu before and after ECAP processing. Vicker’s microhardness...

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Bibliographic Details
Main Authors: mahmoud EL-Shenawy, Waleed. H. El-Garaihy, Medhat Elhadek, Mohamed zaki, Ahmed Nassef
Format: Article
Language:English
Published: Port Said University 2022-12-01
Series:Port Said Engineering Research Journal
Subjects:
ecap
die90
die120
pure copper
Online Access:https://pserj.journals.ekb.eg/article_256707_020a5665fab4c78730441fadea1f33ab.pdf

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