Analytical thermal resistance network model for calculating each mean die temperature of the multi-chips module combined with quad flat no-leads packaging
With the rapid advancement of next-generation communication technology, traditional Quad Flat No-leads (QFN) packaging is facing challenges to meet functional requirements. Due to its high integration and excellent thermal performance, the Multi-chips Module combined with Quad Flat No-leads (MCM-QFN...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
AIP Publishing LLC
2023-08-01
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| Series: | AIP Advances |
| Online Access: | http://dx.doi.org/10.1063/5.0152571 |