TECHNOLOGY OF LASER CUTTING OF SILICON WAFERS INTO ORGANIC LIGHT-EMITTING DIODE CHIPS
The article deals with the matter of crystal quality in the production of microdisplays based on organic light-emitting diodes (OLEDs) after separation. This work aimed at increasing the product yield in cutting a silicon device wafer into chips by a method based on laser controlled thermocracking (...
| Main Authors: | , |
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| Format: | Article |
| Language: | Russian |
| Published: |
MIREA - Russian Technological University
2016-06-01
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| Series: | Российский технологический журнал |
| Subjects: | |
| Online Access: | https://www.rtj-mirea.ru/jour/article/view/20 |