Influence of Analog and Digital Crease Lines on Mechanical Parameters of Corrugated Board and Packaging

When producing packaging from corrugated board, material weakening often occurs both during the die-cutting process and during printing. While the analog lamination and/or printing processes that degrade material can be easily replaced with a digital approach, the die-cutting process remains overwhe...

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Những tác giả chính: Tomasz Garbowski, Tomasz Gajewski, Anna Knitter-Piątkowska
Định dạng: Bài viết
Ngôn ngữ:English
Được phát hành: MDPI AG 2022-06-01
Loạt:Sensors
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Truy cập trực tuyến:https://www.mdpi.com/1424-8220/22/13/4800